Rosin Foam Flux - WS31

Characteristics

WS31 Rosin Foam Flux is an activated, Non-Corrosive Rosin based liquid flux, which has been specially formulated to reduce Icicles and bridging to a minimum on PCB. The minimal residues left on the boards are non-sticky, protective and non-corrosive. WS 32 & WS 38 are Rosin mildly activated flux with different solid contents. It can also be offered in various solid content.

Application

ROSIN Liquid Flux can be used for the Wave/Dip/Spray soldering of all printed circuit boards to give fast production speeds and reliable soldering. Because of its special action of suppressing Icicles and bridging, it will be found that soldering machine setting are not so critical as with other Rosin based fluxes.

Flux Control

The concentration of Rosin based flux increases during usage because of loss of the solvent. The concentration of the flux can easily be maintained by replacing the lost solvent periodically with WS 71 thinner. The specific gravity of the modified solution is monitored by using Hydrometer until it reaches required specific gravity.

Removal Of Flux Residue

Due to its solid content, this flux leaves only traces of non-corrosive residues. If removal of the residues becomes necessary, it can be done by washing with commercial solvent mixture. All known cleaning processes can be employed.

Technical Data

Safety Information

Take all normal precautions for its handling, use, and storage. It should be used in a well ventilated area. Keep away from sources of flame and heat. The prescribed containers must be stored tightly closed in a well-ventilated area.

Packaging

5, 10, 20 Litres.Cans 200 Litres Drums